![]() ![]() ![]() It can also confirm whether the component exists, but it cannot confirm whether the components, the directions, and the values are correct. X-rays mainly focus on the quality of solder joints. The combined SMT PCBA testing technology is nearly perfect because each technology compensates for another technology’s shortcomings. Still, AXI technology cannot test the defects and faults in the electrical performance of the circuit.Ĭombining AXI testing technology with traditional ICT online testing methods can complement each other. The process defects generally account for 80%-90% of the total defects, and invisible solder joints can also be inspected. AXI technology is not affected by the above factors, and its coverage of process defects is very high, usually up to 97%. In addition, increasing the number of ICT contacts will increase the number of ICT test errors and retests. It usually takes several weeks to develop test programs and fixtures, and it may even take more than a month for more complex circuit boards. However, as the number of contacts increases, the cost of test programming and needle bed fixtures also rises exponentially. With the increasing density of most complex circuit boards, traditional testing methods can only increase the number of test contacts of the online tester. It is difficult to diagnose defects through ICT tests and functional tests. The 3D inspection method can independently image the solder joints on both sides of the circuit board.Īs the current circuit boards are becoming more complex, the traditional circuit contact test is greatly restricted. ![]() As a result, the 3D inspection method the image is eliminated. In contrast, the images on other layers are eliminated. The beam is focused on any layer, and the corresponding image is projected to a high-speed rotation to make the image at the focal point very clear. The 3D inspection method uses layered technology. Still, for the currently widely used double-sided mounting circuit boards, the effect will be very poor, resulting in a visual image of both sides’ solder joints. They overlap and are extremely difficult to distinguish. The former is a transmission X-ray inspection method, which can produce a clear image of the component solder joints on a single panel. ![]() AXI technology has developed from the 2D to the current 3D inspection method. Thus, the analysis of solder joints is quite intuitive, as image analysis algorithms can automatically and reliably inspect solder joint defects. The X-ray emitted passes through the circuit board and is received by the detector (usually a camera) underneath. Because the solder joints contain a large amount of lead that can absorb X-rays,Ĭompared with other materials such as glass fiber, copper, silicon, etc., the X-rays irradiated on the solder joints are absorbed and appear as black spots. When the assembled circuit board (PCBA) enters the inside of the machine along the guide rail, there is an X-Ray emission tube above the circuit board.
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